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Chemical content 74HC4053D

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Type numberPackagePackage descriptionTotal product weight
74HC4053DSOT109-1SO16137.63281 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9337148406532012601235Shanghai, China; Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1311577.900000.09529
PolymerAcrylic resinProprietary0.0255915.200000.01859
Resin systemProprietary0.011626.900000.00844
subTotal0.16836100.000000.12232
DieDoped siliconSilicon (Si)7440-21-30.48953100.000000.35568
subTotal0.48953100.000000.35568
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-848.6504297.4700035.34798
Iron (Fe)7439-89-61.197922.400000.87037
Phosphorus (P)7723-14-00.014970.030000.01088
Zinc (Zn)7440-66-60.049910.100000.03627
subTotal49.91322100.0000036.26550
Mould CompoundFillerSilica -amorphous-7631-86-90.513970.600000.37344
Silica fused60676-86-067.0991478.3300048.75228
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.225396.100003.79662
PigmentCarbon black1333-86-40.171320.200000.12448
PolymerEpoxy resin systemProprietary7.591388.862005.51567
Phenolic resinProprietary5.060925.908003.67712
subTotal85.66212100.0000062.23961
Pre-PlatingPure metal layerGold (Au)7440-57-50.012791.000000.00929
Nickel (Ni)7440-02-01.2408897.000000.90159
Palladium (Pd)7440-05-30.025592.000000.01859
subTotal1.27926100.000000.92947
WirePure metalCopper (Cu)7440-50-80.12031100.000000.08742
subTotal0.12031100.000000.08742
total137.63281100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.