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Chemical content 74HC42D

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Type numberPackagePackage descriptionTotal product weight
74HC42DSOT109-1SO16143.45277 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9337148606531212601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-42.0025080.100001.39593
PolymerResin systemProprietary0.4975019.900000.34680
subTotal2.50000100.000001.74273
DieDoped siliconSilicon (Si)7440-21-31.56150100.000001.08851
subTotal1.56150100.000001.08851
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-869.2037097.4700048.24145
Iron (Fe)7439-89-61.704002.400001.18785
Phosphorus (P)7723-14-00.021300.030000.01485
Zinc (Zn)7440-66-60.071000.100000.04949
subTotal71.00000100.0000049.49364
Mould CompoundFillerSilica -amorphous-7631-86-90.408000.600000.28441
Silica fused60676-86-053.2644078.3300037.13027
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.148006.100002.89154
PigmentCarbon black1333-86-40.136000.200000.09480
PolymerEpoxy resin systemProprietary6.026168.862004.20080
Phenolic resinProprietary4.017445.908002.80053
subTotal68.00000100.0000047.40235
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00209
Nickel (Ni)7440-02-00.2910097.000000.20285
Palladium (Pd)7440-05-30.006002.000000.00418
subTotal0.30000100.000000.20912
WirePure metalCopper (Cu)7440-50-80.09127100.000000.06362
subTotal0.09127100.000000.06362
total143.45277100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.