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Chemical content 74HCT11PW

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Type numberPackagePackage descriptionTotal product weight
74HCT11PWSOT402-1TSSOP1452.09930 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9351863501181212601235Nijmegen, Netherlands; Shanghai, China; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0311677.900000.05981
PolymerAcrylic resinProprietary0.0060815.200000.01167
Resin systemProprietary0.002766.900000.00530
subTotal0.04000100.000000.07678
DieDoped siliconSilicon (Si)7440-21-30.46903100.000000.90026
subTotal0.46903100.000000.90026
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.0456497.4700036.55642
Iron (Fe)7439-89-60.468962.400000.90013
Phosphorus (P)7723-14-00.005860.030000.01125
Zinc (Zn)7440-66-60.019540.100000.03751
subTotal19.54000100.0000037.50531
Mould CompoundFillerSilica -amorphous-7631-86-90.190080.600000.36484
Silica fused60676-86-024.8149478.3300047.63009
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-81.932486.100003.70922
PigmentCarbon black1333-86-40.063360.200000.12161
PolymerEpoxy resin systemProprietary2.807488.862005.38871
Phenolic resinProprietary1.871655.908003.59248
subTotal31.68000100.0000060.80695
Pre-PlatingPure metal layerGold (Au)7440-57-50.002901.000000.00557
Nickel (Ni)7440-02-00.2813097.000000.53993
Palladium (Pd)7440-05-30.005802.000000.01113
subTotal0.29000100.000000.55663
WirePure metalCopper (Cu)7440-50-80.08027100.000000.15408
subTotal0.08027100.000000.15408
total52.09930100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.