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Chemical content 74HCT174D

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Type numberPackagePackage descriptionTotal product weight
74HCT174DSOT109-1SO16143.77981 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9337150506531412601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01625
PolymerAcrylic resinProprietary0.0045615.200000.00317
Resin systemProprietary0.002076.900000.00144
subTotal0.03000100.000000.02086
DieDoped siliconSilicon (Si)7440-21-31.13273100.000000.78782
subTotal1.13273100.000000.78782
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-836.7218297.4700025.54032
Iron (Fe)7439-89-60.904202.400000.62888
Phosphorus (P)7723-14-00.011300.030000.00786
Zinc (Zn)7440-66-60.037680.100000.02620
subTotal37.67500100.0000026.20326
Mould CompoundFillerSilica -amorphous-7631-86-90.625620.600000.43512
Silica fused60676-86-081.6746978.3300056.80540
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.360476.100004.42376
PigmentCarbon black1333-86-40.208540.200000.14504
PolymerEpoxy resin systemProprietary9.240418.862006.42678
Phenolic resinProprietary6.160275.908004.28452
subTotal104.27000100.0000072.52062
Pre-PlatingPure metal layerGold (Au)7440-57-50.005651.000000.00393
Nickel (Ni)7440-02-00.5480597.000000.38117
Palladium (Pd)7440-05-30.011302.000000.00786
subTotal0.56500100.000000.39296
WirePure metalCopper (Cu)7440-50-80.10708100.000000.07448
subTotal0.10708100.000000.07448
total143.77981100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.