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Chemical content 74HCT4066PW-Q100

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Type numberPackagePackage descriptionTotal product weight
74HCT4066PW-Q100SOT402-1TSSOP1459.81321 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935298459118812601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.02605
PolymerAcrylic resinProprietary0.0030415.200000.00508
Resin systemProprietary0.001386.900000.00231
subTotal0.02000100.000000.03344
DieDoped siliconSilicon (Si)7440-21-30.35253100.000000.58938
subTotal0.35253100.000000.58938
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-818.7809297.4700031.39928
Iron (Fe)7439-89-60.462442.400000.77314
Phosphorus (P)7723-14-00.005780.030000.00966
Zinc (Zn)7440-66-60.019270.100000.03221
subTotal19.26841100.0000032.21429
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39724
Silica fused60676-86-031.0186878.3300051.85925
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100004.03857
PigmentCarbon black1333-86-40.079200.200000.13241
PolymerEpoxy resin systemProprietary3.509358.862005.86719
Phenolic resinProprietary2.339575.908003.91146
subTotal39.60000100.0000066.20612
Pre-PlatingPure metal layerGold (Au)7440-57-50.014673.000000.02453
Nickel (Ni)7440-02-00.4514692.300000.75478
Palladium (Pd)7440-05-30.015163.100000.02535
Silver (Ag)7440-22-40.007831.600000.01308
subTotal0.48912100.000000.81774
WirePure metalCopper (Cu)7440-50-80.08315100.000000.13901
subTotal0.08315100.000000.13901
total59.81321100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.