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Chemical content 74LV04D

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Type numberPackagePackage descriptionTotal product weight
74LV04DSOT108-1SO14136.49691 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9350631301181212601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-42.0025080.100001.46707
PolymerResin systemProprietary0.4975019.900000.36448
subTotal2.50000100.000001.83155
DieDoped siliconSilicon (Si)7440-21-30.62635100.000000.45888
subTotal0.62635100.000000.45888
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-863.3555097.4700046.41534
Iron (Fe)7439-89-61.560002.400001.14288
Phosphorus (P)7723-14-00.019500.030000.01429
Zinc (Zn)7440-66-60.065000.100000.04762
subTotal65.00000100.0000047.62013
Mould CompoundFillerSilica -amorphous-7631-86-90.408000.600000.29891
Silica fused60676-86-053.2644078.3300039.02242
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.148006.100003.03890
PigmentCarbon black1333-86-40.136000.200000.09964
PolymerEpoxy resin systemProprietary6.026168.862004.41487
Phenolic resinProprietary4.017445.908002.94325
subTotal68.00000100.0000049.81799
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00220
Nickel (Ni)7440-02-00.2910097.000000.21319
Palladium (Pd)7440-05-30.006002.000000.00440
subTotal0.30000100.000000.21979
WirePure metalCopper (Cu)7440-50-80.07056100.000000.05169
subTotal0.07056100.000000.05169
total136.49691100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.