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Chemical content 74LV4060D-Q100

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Type numberPackagePackage descriptionTotal product weight
74LV4060D-Q100SOT109-1SO16162.65239 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300454118612601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.00958
PolymerAcrylic resinProprietary0.0030415.200000.00187
Resin systemProprietary0.001386.900000.00085
subTotal0.02000100.000000.01230
DieDoped siliconSilicon (Si)7440-21-30.80744100.000000.49642
subTotal0.80744100.000000.49642
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-854.6301297.4700033.58704
Iron (Fe)7439-89-61.345162.400000.82701
Phosphorus (P)7723-14-00.016810.030000.01034
Zinc (Zn)7440-66-60.056050.100000.03446
subTotal56.04814100.0000034.45885
Mould CompoundFillerSilica -amorphous-7631-86-90.625480.600000.38455
Silica fused60676-86-081.6566878.3300050.20318
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.359076.100003.90961
PigmentCarbon black1333-86-40.208490.200000.12818
PolymerEpoxy resin systemProprietary9.238378.862005.67982
Phenolic resinProprietary6.158915.908003.78655
subTotal104.24700100.0000064.09189
Pre-PlatingPure metal layerGold (Au)7440-57-50.042683.000000.02624
Nickel (Ni)7440-02-01.3132192.300000.80737
Palladium (Pd)7440-05-30.044113.100000.02712
Silver (Ag)7440-22-40.022761.600000.01400
subTotal1.42276100.000000.87473
WirePure metalCopper (Cu)7440-50-80.10705100.000000.06581
subTotal0.10705100.000000.06581
total162.65239100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.