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Chemical content 74LVC07AD

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Type numberPackagePackage descriptionTotal product weight
74LVC07ADSOT108-1SO14123.11341 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352654811181712601235Suzhou, China; Bangkok, Thailand; Shanghai, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0779077.900000.06327
PolymerAcrylic resinProprietary0.0152015.200000.01235
Resin systemProprietary0.006906.900000.00560
subTotal0.10000100.000000.08122
DieDoped siliconSilicon (Si)7440-21-30.13610100.000000.11054
subTotal0.13610100.000000.11054
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-843.4131497.4700035.26272
Iron (Fe)7439-89-61.068962.400000.86827
Phosphorus (P)7723-14-00.013360.030000.01085
Zinc (Zn)7440-66-60.044540.100000.03618
subTotal44.54000100.0000036.17802
Mould CompoundFillerSilica -amorphous-7631-86-90.465540.600000.37814
Silica fused60676-86-060.7762578.3300049.36607
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.732996.100003.84441
PigmentCarbon black1333-86-40.155180.200000.12605
PolymerEpoxy resin systemProprietary6.876038.862005.58512
Phenolic resinProprietary4.584025.908003.72341
subTotal77.59000100.0000063.02320
Pre-PlatingPure metal layerGold (Au)7440-57-50.006701.000000.00544
Nickel (Ni)7440-02-00.6499097.000000.52789
Palladium (Pd)7440-05-30.013402.000000.01088
subTotal0.67000100.000000.54421
WirePure metalCopper (Cu)7440-50-80.07732100.000000.06280
subTotal0.07732100.000000.06280
total123.11341100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.