Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BSR33

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BSR33SOT89MPT340.534950 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93341814013515126030 s123520 s3
93341814011515126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.08470077.0000000.208955
PolymerResin systemProprietary0.02530023.0000000.062415
subTotal0.110000100.0000000.271371
DieDoped siliconSilicon (Si)7440-21-30.340000100.0000000.838782
subTotal0.340000100.0000000.838782
Lead FrameCopper alloyCopper (Cu)7440-50-817.12911299.82000042.257637
Iron (Fe)7439-89-60.0171600.1000000.042334
Phosphorus (P)7723-14-00.0051480.0300000.012700
Pure metal layerSilver (Ag)7440-22-40.0085800.0500000.021167
subTotal17.160000100.00000042.333838
Mould CompoundAdditiveNon hazardousProprietary0.6614902.9000001.631900
Triphenylphosphine603-35-00.0114050.0500000.028136
FillerSilica -amorphous-7631-86-916.42320072.00000040.516147
PigmentCarbon black1333-86-40.0114050.0500000.028136
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-23.42150015.0000008.440864
Phenol Formaldehyde resin (generic)9003-35-42.28100010.0000005.627243
subTotal22.810000100.00000056.272427
Post-PlatingImpurityLead (Pb)7439-92-10.0000030.0045000.000008
Non hazardousProprietary0.0000390.0555000.000096
Tin solderTin (Sn)7440-31-50.06995899.9400000.172587
subTotal0.070000100.0000000.172690
WirePure metalGold (Au)7440-57-50.044950100.0000000.110892
subTotal0.044950100.0000000.110892
total40.534950100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.