Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PBSS4130QA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBSS4130QASOT1215DFN1010D-31.270712 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340671651473126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.02400080.0000001.888705
PolymerAcrylic resinProprietary0.00600020.0000000.472176
subTotal0.030000100.0000002.360881
DieDoped siliconSilicon (Si)7440-21-30.160000100.00000012.591366
subTotal0.160000100.00000012.591366
Lead FrameCopper alloyChromium (Cr)7440-47-30.0012720.2400000.100101
Copper (Cu)7440-50-80.50090394.51000039.419082
Tin (Sn)7440-31-50.0012720.2400000.100101
Zinc (Zn)7440-66-60.0011130.2100000.087589
Pure metal layerGold (Au)7440-57-50.0003710.0700000.029196
Nickel (Ni)7440-02-00.0229494.3300001.805995
Palladium (Pd)7440-05-30.0021200.4000000.166836
subTotal0.530000100.00000041.708900
Mould CompoundFillerSilica -amorphous-7631-86-90.11730023.0000009.231045
Silica fused60676-86-00.30600060.00000024.080988
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.0153003.0000001.204049
Ion trapping agentBismuth (Bi)7440-69-90.0025500.5000000.200675
PigmentCarbon black1333-86-40.0025500.5000000.200675
PolymerEpoxy resin systemProprietary0.0357007.0000002.809449
Phenolic resinProprietary0.0306006.0000002.408099
subTotal0.510000100.00000040.134979
Post-PlatingImpurityLead (Pb)7439-92-10.0000010.0045000.000106
Non hazardousProprietary0.0000170.0555000.001310
Tin solderTin (Sn)7440-31-50.02998299.9400002.359465
subTotal0.030000100.0000002.360881
WireImpurityNon hazardousProprietary0.0000010.0100000.000084
Pure metalGold (Au)7440-57-50.01071199.9900000.842908
subTotal0.010712100.0000000.842992
total1.270712100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.