Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PUMX2

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PUMX2SOT363SC-885.472218 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340599641251712601235
9340599641151412601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.080000100.0000001.461930
subTotal0.080000100.0000001.461930
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0020700.1000000.037827
Carbon (C)7440-44-00.0010350.0500000.018914
Chromium (Cr)7440-47-30.0051750.2500000.094569
Cobalt (Co)7440-48-40.0103500.5000000.189137
Iron (Fe)7439-89-61.14264055.20000020.880747
Manganese (Mn)7439-96-50.0207001.0000000.378274
Nickel (Ni)7440-02-00.86070641.58000015.728650
Phosphorus (P)7723-14-00.0006210.0300000.011348
Silicon (Si)7440-21-30.0062100.3000000.113482
Sulphur (S)7704-34-90.0006210.0300000.011348
Pure metal layerCopper (Cu)7440-50-80.0173880.8400000.317750
Silver (Ag)7440-22-40.0024840.1200000.045393
subTotal2.070000100.00000037.827440
Mould CompoundFillerSilica fused60676-86-02.20794075.10000040.348173
PigmentCarbon black1333-86-40.0088200.3000000.161178
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.51450017.5000009.402038
Phenol Formaldehyde resin (generic)9003-35-40.2087407.1000003.814541
subTotal2.940000100.00000053.725930
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000110.0030000.000203
Bismuth (Bi)7440-69-90.0000040.0010000.000068
Copper (Cu)7440-50-80.0000040.0010000.000068
Lead (Pb)7439-92-10.0000180.0050000.000338
Tin solderTin (Sn)7440-31-50.36996399.9900006.760750
subTotal0.370000100.0000006.761427
WirePure metalCopper (Cu)7440-50-80.012218100.0000000.223273
subTotal0.012218100.0000000.223273
total5.472218100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.