Orderable parts
Type number | Orderable part number | Ordering code (12NC) | Package | Buy from distributors |
---|---|---|---|---|
PESD1USB30 | PESD1USB30Z | 934069595087 | WLCSP5_2-1-2 | Order product |
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Click here for more informationESD protection for differential data lines
PESD1USB30 is an ElectroStatic Discharge (ESD) protection device for one differential channel.
It is footprint compatible to PCMF1USB30 common mode filters with ESD protection.
Allows switching between PCMF1USB30 common mode filters with ESD protection and PESD1USB30 ESD protection in the same footprint.
The diodes provide protection to downstream components from ESD voltages up to +/- 15 kV on each signal line.
TrEOS process for very high system-level ESD robustness: superior protection of sensitive Systems on Chips (SoCs).
Industry-standard Wafer-Level Chip Scale package (WLCSP5).
Smartphone, cellular and cordless phone
Tablet PC and Mobile Internet Device (MID)
USB3.1, USB2.0, HDMI2.0, HDMI1.4
MIPI D-PHY as used in Camera Serial Interface (CSI) and Display Serial Interface (DSI)
General-purpose downstream ESD protection for differential data lines
Type number | Package name | Nr of lines | Configuration | VRWM (V) (V) | Cd [typ] (pF) | VESD IEC61000-4-2 (kV) |
---|---|---|---|---|---|---|
PESD1USB30 | WLCSP5 | 1 | Unidirectional | 5 | 0.45 | 15 |
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
PESD1USB30 | PESD1USB30Z (934069595087) |
Active |
WLCSP5 (WLCSP5_2-1-2) |
WLCSP5_2-1-2 | Not available |
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
PESD1USB30 | PESD1USB30Z | PESD1USB30 |
File name | Title | Type | Date |
---|---|---|---|
PESDXUSB30_SER | ESD protection for differential data lines | Data sheet | 2018-04-17 |
WLCSP5_2-1-2 | 3D model for products with WLCSP5_2-1-2 package | Design support | 2023-03-13 |
nexperia_document_leaflet_WLCSP_201803_CHN | WLCSP Chinese Translation | Leaflet | 2018-04-25 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
WLCSP5_2-1-2_mk | wafer level chip-size package; 5 bumps (2-1-2) | Marcom graphics | 2017-01-28 |
WLCSP5_2-1-2 | wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
PESD1USB30_Nexperia_Product_Reliability | PESD1USB30 Nexperia Product Reliability | Quality document | 2024-06-14 |
If you are in need of design/technical support, let us know and fill in the answer form we'll get back to you shortly.
File name | Title | Type | Date |
---|---|---|---|
WLCSP5_2-1-2 | 3D model for products with WLCSP5_2-1-2 package | Design support | 2023-03-13 |
Type number | Orderable part number | Ordering code (12NC) | Status | Packing | Packing Quantity | Buy online |
---|---|---|---|---|---|---|
PESD1USB30 | PESD1USB30Z | 934069595087 | Active | Not available | 4,500 | Order product |
As a Nexperia customer you can order samples via our sales organization.
If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples. Check out the list of official distributors.
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.