2 A low V_F MEGA Schottky barrier rectifier

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection. PMEG3020EPA is encapsulated in an ultra thin SOT1061 leadless small Surface-Mounted Device (SMD) plastic package with medium power capability.


  • Average forward current: IF(AV) ≤ 2 A
  • Reverse voltage: VR ≤ 30 V
  • Low forward voltage
  • Exposed heat sink (cathode pad) for excellent thermal and electrical conductivity
  • Leadless small SMD plastic package with medium power capability
  • AEC-Q101 qualified

Target applications

  • Low voltage rectification
  • High efficiency DC-to-DC conversion
  • Switch Mode Power Supply (SMPS)
  • Reverse polarity protection
  • Low power consumption applications
  • Battery chargers for mobile equipment


Type numberPackage versionPackage nameSize (mm)IF (A)VR (V)ConfigurationIR [max] (mA)IFSM [max] (A)Cd [max] (pF)VF [max] (mV)
PMEG3020EPASOT1061DFN2020-32 x 2 x 0.65230single2,5@VR=30V1755@VR=10V470@IF=2A


Type numberPackageOutline versionReflow-/Wave solderingPackingStatusMarkingOrderable part number, (Ordering code (12NC))
Reel 7" Q1/T1ActiveA2PMEG3020EPA,115
( 9340 634 85115 )


Type numberOrderable part numberChemical contentRoHS / RHFLeadfree conversion dateEFRIFRMTBF (hour)MSLMSL leadfree
PMEG3020EPAPMEG3020EPA,115PMEG3020EPAAlways Pb-free157.00.731.37E911
Quality and reliability disclaimer

Documentation (10)

File nameTitleTypeDate
PMEG3020EPA2 A low V_F MEGA Schottky barrier rectifierData sheet2009-12-24
AN11470Leadless Schottky diodes in a DC-to-DC step-up converterApplication note2015-03-06
750174251 and 2 A Schottky rectifiers in leadless medium-power package; NXP low VF (MEGA) Schottky rectifier PMEGxEPA in SOT1061Leaflet2013-04-19
PMEG3020EPA_Nexperia_Product_QualityPMEG3020EPA Nexperia Product QualityQuality document2017-05-16
PMEG3020EPA_Nexperia_Product_ReliabilityPMEG3020EPA Nexperia Product ReliabilityQuality document2017-05-23
75017631Discretes Semiconductors Selection Guide 2016Selection guide2016-02-16
PMEG3020EPAPMEG3020EPA SPICE modelSPICE model2012-07-21
SOT1061_115DFN2020-3; reel pack; standard product orientation; 12NC ending 115Packing2012-11-07
Reflow_Soldering_ProfileReflow Soldering ProfileReflow soldering2013-12-23
SOT1061plastic, thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm bodyOutline drawing2017-01-30


Find answers to your design questions on this page. If available you can find information in our Nexperia Support Community or you can find Nexperia models and Design tools.


File nameTitleTypeDate
PMEG3020EPAPMEG3020EPA SPICE modelSPICE model2012-07-21


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