Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PBHV9115TLH-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBHV9115TLH-QSOT23TO-236AB8.220400 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346665132151126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.440000100.0000005.352538
subTotal0.440000100.0000005.352538
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0024630.0900000.029966
Carbon (C)7440-44-00.0010950.0400000.013318
Chromium (Cr)7440-47-30.0060210.2200000.073249
Cobalt (Co)7440-48-40.0117690.4300000.143169
Iron (Fe)7439-89-61.31321347.98000015.975045
Manganese (Mn)7439-96-50.0235380.8600000.286339
Nickel (Ni)7440-02-00.98915236.14000012.032891
Phosphorus (P)7723-14-00.0005470.0200000.006659
Silicon (Si)7440-21-30.0071160.2600000.086568
Sulphur (S)7704-34-90.0005470.0200000.006659
Pure metal layerCopper (Cu)7440-50-80.31119711.3700003.785666
Silver (Ag)7440-22-40.0703412.5700000.855687
subTotal2.737000100.00000033.295217
Mould CompoundFillerSilica fused60676-86-03.43498071.00000041.786044
PigmentCarbon black1333-86-40.0145140.3000000.176561
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.95308619.70000011.594156
Phenolic resinProprietary0.4354209.0000005.296823
subTotal4.838000100.00000058.853584
Post-PlatingImpurityLead (Pb)7439-92-10.0000090.0045000.000104
Non hazardousProprietary0.0001050.0555000.001283
Tin solderTin (Sn)7440-31-50.18988699.9400002.309936
subTotal0.190000100.0000002.311323
WireImpurityNon hazardousProprietary0.0000020.0100000.000019
Pure metalGold (Au)7440-57-50.01539899.9900000.187320
subTotal0.015400100.0000000.187339
total8.220400100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.