Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

ADAS front / rear camera systems

In the last decade innovation in Advanced Driver Assistance System (ADAS) camera systems has been incremental. Front-vision cameras are the most common and can be mono, stereo or tri-focal. They are often used for features such as Forward Collision Warning, Adaptive Cruise Control and Lane Departure Warning. Surround-view camera systems are the next most common, located around the car and typically used for parking assistance, blind spot detection and providing a 360° monitoring view. All the camera systems may also include embedded data processing capabilities.


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  • Product listing
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Block diagram

TVSdiode VCCA VCCB Ballasttransistor SBC Interface aaa-040132 Ethernet ADAS module Camera module SerDes Ethernet Lens defogging Highlighted components are Nexperia focus products.

Transient Voltage Suppressors (TVS)

ESD bus protection

Ballast transistor

Control logic

Voltage translators

ESD bus protection

Select a component

To view more information about the Nexperia components used in this application, please select a component above or click on a component (highlighted in blue) in the block diagram.

Design considerations

 

  • With various camera systems and multiple radars required for full 360 degree sensing space is extremely limited
  • Move to ‘postage stamp’ camera systems, specifically for surround-view systems, to save overall system space
  • Move to CFP and LFPAK packages for space saving, thermal efficiency and system robustness

 

Check out Nexperia’s first application techbook on Radar Systems

For a comprehensive understanding of the latest advancements in ADAS Radar Systems, download our new techbook and:

  • understand the different application trends
  • dive into design challenges and learn how to overcome them
  • get to know the various Nexperia solutions available for each design challenge
  • discover a list of recommended products for power and signal electronics.

Improve accuracy of AOI in PCB production by using modern package technology

To enhance AOI Nexperia has introduced its new lead shape which is featured in packages such as the CFP15B and CFP2-HP. Watch this video and learn how this new lead shape delivers a more uniform solder joint which is easier to detect with AOI.