N-channel 25 V 0.99 mΩ logic level MOSFET in LFPAK using NextPower technology

Logic level enhancement mode N-channel MOSFET in LFPAK package. This product is designed and qualified for use in a wide range of industrial, communications and domestic equipment.


  • High reliability Power SO8 package, qualified to 175°C
  • Optimised for 4.5V Gate drive utilising NextPower Superjunction technology
  • Ultra low QG, QGD & QOSS for high system efficiencies at low and high loads
  • Ultra low Rdson and low parasitic inductance

Target applications

  • DC-to-DC converters
  • Lithium-ion battery protection
  • Load switching
  • Power OR-ing
  • Server power supplies
  • Sync rectifier


Type numberPackage nameProduct statusChannel typeNumber of transistorsVDS [max] (V)RDSon [max] @ VGS = 10 V (mΩ)RDSon [max] @ VGS = 4.5 V (mΩ)Tj [max] (°C)ID [max] (A)QGD [typ] (nC)QG(tot) [typ] @ VGS = 4.5 V (nC)QG(tot) [typ] @ VGS = 10 V (nC)Ptot [max] (W)Qr [typ] (nC)VGSth [typ] (V)Automotive qualifiedCiss [typ] (pF)Coss [typ] (pF)Date
PSMN0R9-25YLCLFPAK56; Power-SO8ProductionN1250.991.251751001451110272601.41N677514372011-02-25


Type numberPackageOutline versionReflow-/Wave solderingPackingStatusMarkingOrderable part number, (Ordering code (12NC))
LFPAK56; Power-SO8
SOT669Reel 7" Q1/T1Active0C925LPSMN0R9-25YLC,115
( 9340 650 74115 )


Type numberOrderable part numberChemical contentRoHS / RHFLeadfree conversion dateMSLMSL leadfree
Quality and reliability disclaimer

Documentation (20)

File nameTitleTypeDate
PSMN0R9-25YLCN-channel 25 V 0.99 mΩ logic level MOSFET in LFPAK using NextPower technologyData sheet2017-05-04
AN10273Power MOSFET single-shot and repetitive avalanche ruggedness ratingApplication note2015-12-10
AN10874LFPAK MOSFET thermal design guideApplication note2011-01-27
AN11113LFPAK MOSFET thermal design guide - Part 2Application note2011-11-16
AN11158Understanding power MOSFET data sheet parametersApplication note2014-02-04
AN11160Designing RC SnubbersApplication note2012-10-01
AN11156Using Power MOSFET Zth CurvesApplication note2012-10-10
AN11243Failure signature of Electrical Overstress on Power MOSFETsApplication note2012-10-29
AN11261Using RC Thermal ModelsApplication note2014-05-19
AN11599Using power MOSFETs in parallelApplication note2016-07-13
75017659Ultra-reliable LFPAK56 and LFPAK33Brochure2015-05-17
75017631Discretes Semiconductors Selection Guide 2016Selection guide2016-02-16
75017590NXP's Power MOSFET Selection Guide 2014: Smaller, faster, coolerSelection guide2014-09-10
PSMN0R9_25YLCPSMN0R9_25YLC Spice modelSPICE model2015-03-29
TN00008Power MOSFET frequently asked questions and answersTechnical note2016-10-31
PSMN0R9-25YLC_RC_Thermal_ModelPSMN0R9-25YLC Thermal design modelThermal design2014-04-30
PSMN0R9-25YLCPSMN0R9-25YLC Thermal modelThermal model2011-04-04
UM1017825 Amp LFPAK demonstration boardUser manual2011-02-17
SOT669_115LFPAK56; Reel pack; SMD, 7" Q1/T1 standard product orientation Orderable part number ending ,115 or X Ordering code (12NC) ending 115Packing2016-09-09
SOT669plastic, single-ended surface-mounted package; 4 terminals; 4.9 mm x 4.45 mm x 1 mm bodyOutline drawing2017-01-31


Find answers to your design questions on this page. If available you can find information in our Nexperia Support Community or you can find Nexperia models and Design tools.


File nameTitleTypeDate
PSMN0R9_25YLCPSMN0R9_25YLC Spice modelSPICE model2015-03-29
PSMN0R9-25YLC_RC_Thermal_ModelPSMN0R9-25YLC Thermal design modelThermal design2014-04-30
PSMN0R9-25YLCPSMN0R9-25YLC Thermal modelThermal model2011-04-04


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