Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PSMN2R3-100SSE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMN2R3-100SSESOT1235LFPAK88355.86000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346615731185126030 s126020 s3Cardiff, Great Britain; Seremban, Malaysia; Cabuyao, Philippines; Manchester, United Kingdom; Sherman, United States Of AmericaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-310.07000100.000002.82976
subTotal10.07000100.000002.82976
ClipCopper alloyCopper (Cu)7440-50-860.0258599.8600016.86783
Iron (Fe)7439-89-60.066120.110000.01858
Phosphorus (P)7723-14-00.018030.030000.00507
subTotal60.11000100.0000016.89148
Lead FrameCopper alloyCopper (Cu)7440-50-8172.5480999.8600048.48763
Iron (Fe)7439-89-60.224630.130000.06312
Phosphorus (P)7723-14-00.051840.030000.01457
subTotal172.79000100.0000048.56532
Mould CompoundFillerSilica -amorphous-7631-86-99.6050010.000002.69910
Silica fused60676-86-072.0375075.0000020.24321
PigmentCarbon black1333-86-40.288150.300000.08097
PolymerEpoxy resin systemProprietary7.395857.700002.07830
Phenolic resinProprietary6.723507.000001.88937
subTotal96.05000100.0000026.99095
Post-PlatingImpurityNon hazardousProprietary0.000490.010000.00014
Tin alloyTin (Sn)7440-31-54.8795199.990001.37119
subTotal4.88000100.000001.37133
Solder PasteImpurityAntimony (Sb)7440-36-00.002000.030000.00056
Lead alloyLead (Pb)7439-92-16.1492692.470001.72800
Silver (Ag)7440-22-40.166252.500000.04672
Tin (Sn)7440-31-50.332505.000000.09344
subTotal6.65000100.000001.86872
Solder PasteImpurityAntimony (Sb)7440-36-00.001590.030000.00045
Lead alloyLead (Pb)7439-92-14.9101692.470001.37980
Silver alloySilver (Ag)7440-22-40.132752.500000.03730
Tin alloyTin (Sn)7440-31-50.265505.000000.07461
subTotal5.31000100.000001.49216
total355.86000100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.