Chemical content PBSS5540Z/8

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PBSS5540Z/8SOT223SC-73103.64150 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346601061154126030 s123520 s3Dongguan, China; D-22529 HAMBURG, Germany 
9346601061356126030 s123520 s3Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1001077.000000.09658
PolymerResin systemProprietary0.0299023.000000.02885
DieDoped siliconSilicon (Si)7440-21-31.25000100.000001.20608
Lead FrameCopper alloyCopper (Cu)7440-50-850.7251499.1500048.94288
Iron (Fe)7439-89-60.051160.100000.04936
Phosphorus (P)7723-14-00.015350.030000.01481
Pure metal layerSilver (Ag)7440-22-40.368350.720000.35541
Mould CompoundAdditiveNon hazardousProprietary1.414912.900001.36520
FillerSilica -amorphous-7631-86-935.1288072.0000033.89453
PigmentCarbon black1333-86-40.024400.050000.02354
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-27.3185015.000007.06136
Phenol Formaldehyde resin (generic)9003-35-44.8790010.000004.70757
Post-PlatingImpurityLead (Pb)7439-92-10.000100.004500.00010
Non hazardousProprietary0.001230.055500.00118
Tin solderTin (Sn)7440-31-52.2086799.940002.13107
WireImpurityNon hazardousProprietary0.000010.010000.00001
Pure metalCopper (Cu)7440-50-80.1014999.990000.09792
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.