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Chemical content PESD12VV1BL

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Type numberPackagePackage descriptionTotal product weight
PESD12VV1BLSOD882DFN1006-20.95390 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934066585315712601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.79673
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.10976
Phenolic resinProprietary0.0013513.530000.14184
subTotal0.01000100.000001.04833
DieDoped siliconSilicon (Si)7440-21-30.06000100.000006.28997
subTotal0.06000100.000006.28997
Lead FrameCopper alloyCopper (Cu)7440-50-80.3874194.4900040.61317
Magnesium (Mg)7439-95-40.000820.200000.08596
Nickel (Ni)7440-02-00.012923.150001.35392
Silicon (Si)7440-21-30.002830.690000.29657
Pure metal layerGold (Au)7440-57-50.000120.030000.01289
Nickel (Ni)7440-02-00.005211.270000.54586
Palladium (Pd)7440-05-30.000700.170000.07307
subTotal0.41000100.0000042.98144
Mould CompoundFillerSilica -amorphous-7631-86-90.1035023.0000010.85019
Silica fused60676-86-00.2700060.0000028.30485
Flame retardantMetal hydroxideProprietary0.013503.000001.41524
ImpurityBismuth (Bi)7440-69-90.002250.500000.23587
PigmentCarbon black1333-86-40.002250.500000.23587
PolymerEpoxy resin systemProprietary0.031507.000003.30223
Phenolic resinProprietary0.027006.000002.83049
subTotal0.45000100.0000047.17474
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00009
Non hazardousProprietary0.000010.055500.00116
Tin solderTin (Sn)7440-31-50.0199999.940002.09540
subTotal0.02000100.000002.09665
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalGold (Au)7440-57-50.0039099.990000.40923
subTotal0.00390100.000000.40927
total0.95390100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.