Chemical content PMDXB600UNEL

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Type numberPackagePackage descriptionTotal product weight
PMDXB600UNELSOT1216DFN1010B-61.21701 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340704321474126030 s123520 s3Sherman, United States Of America; Manchester, United Kingdom; Dongguan, China; Hsin-chu, Taiwan; Kwai Chung, Hong Kong; D-22529 HAMBURG, Germany; Hsinchu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000221.000000.01808
FillerSilver (Ag)7440-22-40.0184884.000001.51848
PolymerBismaleimidodiphenylmethane resin 0.0022010.000000.18077
Isobornyl Methacrylate7534-94-30.001105.000000.09039
DieDoped siliconSilicon (Si)7440-21-30.06000100.000004.93012
Lead FrameCopper alloyCopper (Cu)7440-50-80.4476991.1800036.78637
Magnesium (Mg)7439-95-40.000830.170000.06859
Nickel (Ni)7440-02-00.013942.840001.14579
Silicon (Si)7440-21-30.003040.620000.25014
Pure metal layerGold (Au)7440-57-50.000340.070000.02824
Nickel (Ni)7440-02-00.023034.690001.89217
Palladium (Pd)7440-05-30.002110.430000.17348
Mould CompoundFillerSilica -amorphous-7631-86-90.1393823.0000011.45266
Silica fused60676-86-00.3636060.0000029.87650
Flame retardantMetal hydroxideProprietary0.018183.000001.49383
ImpurityBismuth (Bi)7440-69-90.003030.500000.24897
PigmentCarbon black1333-86-40.003030.500000.24897
PolymerEpoxy resin systemProprietary0.042427.000003.48559
Phenolic resinProprietary0.036366.000002.98765
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00009
Non hazardousProprietary0.000010.055500.00109
Tin solderTin (Sn)7440-31-50.0239999.940001.97086
WireImpurityNon hazardousProprietary0.000000.010000.00012
Pure metalGold (Au)7440-57-50.0140099.990001.15071
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.