Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PMPB50ENE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB50ENESOT1220DFN2020MD-67.164556 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346603541152126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.05600080.0000000.781626
PolymerAcrylic resinProprietary0.01400020.0000000.195406
subTotal0.070000100.0000000.977032
DieDoped siliconSilicon (Si)7440-21-30.240000100.0000003.349824
subTotal0.240000100.0000003.349824
Lead FrameCopper alloyCopper (Cu)7440-50-82.70491393.59560037.754089
Magnesium (Mg)7439-95-40.0042170.1459000.058852
Nickel (Ni)7440-02-00.0843532.9188001.177370
Silicon (Si)7440-21-30.0182760.6324000.255094
Pure metal layerGold (Au)7440-57-50.0009620.0333000.013432
Nickel (Ni)7440-02-00.0740132.5610001.033042
Palladium (Pd)7440-05-30.0032660.1130000.045581
subTotal2.890000100.00000040.337461
Mould CompoundFillerSilica -amorphous-7631-86-90.85790023.00000011.974224
Silica fused60676-86-02.23800060.00000031.237107
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.1119003.0000001.561855
Ion trapping agentBismuth (Bi)7440-69-90.0186500.5000000.260309
PigmentCarbon black1333-86-40.0186500.5000000.260309
PolymerEpoxy resin systemProprietary0.2611007.0000003.644329
Phenolic resinProprietary0.2238006.0000003.123711
subTotal3.730000100.00000052.061844
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000107
Non hazardousProprietary0.0000940.0555000.001317
Tin solderTin (Sn)7440-31-50.16989899.9400002.371368
subTotal0.170000100.0000002.372792
WireImpurityNon hazardousProprietary0.0000060.0100000.000090
Pure metalCopper (Cu)7440-50-80.06455099.9900000.900962
subTotal0.064556100.0000000.901052
total7.164556100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.