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Chemical content PMPB85ENEA

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB85ENEASOT1220SOT12207.22859 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934067478115412601235Sherman, United States Of America; Dongguan, China; Manchester, United Kingdom; Hsin-chu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00968
FillerSilver (Ag)7440-22-40.0588084.000000.81344
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09684
Isobornyl Methacrylate7534-94-30.003505.000000.04842
subTotal0.07000100.000000.96838
DieDoped siliconSilicon (Si)7440-21-30.33000100.000004.56521
subTotal0.33000100.000004.56521
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956037.41965
Magnesium (Mg)7439-95-40.004220.145900.05833
Nickel (Ni)7440-02-00.084352.918801.16694
Silicon (Si)7440-21-30.018280.632400.25283
Pure metal layerGold (Au)7440-57-50.000960.033300.01331
Nickel (Ni)7440-02-00.074012.561001.02389
Palladium (Pd)7440-05-30.003270.113000.04518
subTotal2.89000100.0000039.98013
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.86815
Silica fused60676-86-02.2380060.0000030.96039
Flame retardantMetal hydroxideProprietary0.111903.000001.54802
ImpurityBismuth (Bi)7440-69-90.018650.500000.25800
PigmentCarbon black1333-86-40.018650.500000.25800
PolymerEpoxy resin systemProprietary0.261107.000003.61205
Phenolic resinProprietary0.223806.000003.09604
subTotal3.73000100.0000051.60065
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000090.055500.00131
Tin solderTin (Sn)7440-31-50.1699099.940002.35036
subTotal0.17000100.000002.35178
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalCopper (Cu)7440-50-80.0385999.990000.53385
subTotal0.03859100.000000.53390
total7.22859100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.