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Chemical content PSMN0R9-30ULD

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Type numberPackagePackage descriptionTotal product weight
PSMN0R9-30ULDSOT1023A4 LEADS116.52000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660145115412601260Cabuyao, Philippines; Shanghai, China; Hsin-chu, TaiwanLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-35.10000100.000004.37693
subTotal5.10000100.000004.37693
ClipCopper alloyCopper (Cu)7440-50-827.3637399.8676223.48415
Iron (Fe)7439-89-60.027380.099910.02349
Phosphorus (P)7723-14-00.008900.032470.00764
subTotal27.40000100.0000023.51528
Lead FrameCopper alloyCopper (Cu)7440-50-836.6896596.5517031.48785
Iron (Fe)7439-89-60.917242.413800.78720
Phosphorus (P)7723-14-00.393111.034500.33738
subTotal38.00000100.0000032.61243
Mould CompoundFillerSilica fused60676-86-021.5414071.0000018.48730
PigmentCarbon black1333-86-40.091020.300000.07812
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-25.9769819.700005.12957
Phenolic resinProprietary2.730609.000002.34346
subTotal30.34000100.0000026.03845
Post-PlatingImpurityNon hazardousProprietary0.000190.010000.00016
Tin alloyTin (Sn)7440-31-51.8698199.990001.60471
subTotal1.87000100.000001.60487
Solder PasteLead alloyLead (Pb)7439-92-13.8387592.500003.29450
Silver (Ag)7440-22-40.103752.500000.08904
Tin (Sn)7440-31-50.207505.000000.17808
subTotal4.15000100.000003.56162
Solder PasteImpurityAntimony (Sb)7440-36-00.002900.030000.00249
Lead alloyLead (Pb)7439-92-18.9326092.470007.66615
Silver (Ag)7440-22-40.241502.500000.20726
Tin (Sn)7440-31-50.483005.000000.41452
subTotal9.66000100.000008.29042
total116.52000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.