×

Chemical content PSMN1R3-80SSF

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMN1R3-80SSFSOT1235LFPAK88291.67880 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934666125115112601260Hsin-chu, Taiwan; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-35.16880100.000001.77209
subTotal5.16880100.000001.77209
ClipCopper alloyCopper (Cu)7440-50-80.9986099.860000.34236
Iron (Fe)7439-89-60.001100.110000.00038
Phosphorus (P)7723-14-00.000300.030000.00010
subTotal1.00000100.000000.34284
Lead FrameCopper alloyCopper (Cu)7440-50-8172.5480999.8600059.15689
Iron (Fe)7439-89-60.224630.130000.07701
Phosphorus (P)7723-14-00.051840.030000.01777
subTotal172.79000100.0000059.25167
Mould CompoundFillerSilica -amorphous-7631-86-914.4075015.000004.93951
Silica fused60676-86-071.5572574.5000024.53289
PigmentCarbon black1333-86-40.480250.500000.16465
PolymerEpoxy resin systemProprietary4.802505.000001.64650
Phenolic resinProprietary4.802505.000001.64650
subTotal96.05000100.0000032.93005
Post-PlatingImpurityNon hazardousProprietary0.000490.010000.00017
Tin alloyTin (Sn)7440-31-54.8795199.990001.67291
subTotal4.88000100.000001.67308
Solder PasteImpurityAntimony (Sb)7440-36-00.002000.030000.00068
Lead alloyLead (Pb)7439-92-16.1492692.470002.10823
Silver (Ag)7440-22-40.166252.500000.05700
Tin (Sn)7440-31-50.332505.000000.11400
subTotal6.65000100.000002.27991
Solder PasteImpurityAntimony (Sb)7440-36-00.001540.030000.00053
Lead alloyLead (Pb)7439-92-14.7529692.470001.62952
Silver alloySilver (Ag)7440-22-40.128502.500000.04406
Tin alloyTin (Sn)7440-31-50.257005.000000.08811
subTotal5.14000100.000001.76222
total291.67880100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.