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Chemical content PSMN1R9-40YSD

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Type numberPackagePackage descriptionTotal product weight
PSMN1R9-40YSDSOT669LFPAK85.48000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660733115212601260Cabuyao, Philippines; Hsin-chu, TaiwanLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-33.30000100.000003.86055
subTotal3.30000100.000003.86055
ClipCopper alloyCopper (Cu)7440-50-84.9933899.867625.84158
Iron (Fe)7439-89-60.005000.099910.00584
Phosphorus (P)7723-14-00.001620.032470.00190
subTotal5.00000100.000005.84932
Lead FrameCopper alloyCopper (Cu)7440-50-837.8307699.8700044.25685
Iron (Fe)7439-89-60.037880.100000.04431
Phosphorus (P)7723-14-00.011360.030000.01329
subTotal37.88000100.0000044.31445
Mould CompoundFillerSilica fused60676-86-013.7433061.0000016.07780
Flame retardantZinc Borate138265-88-02.2530010.000002.63570
PigmentCarbon black1333-86-40.067590.300000.07907
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.4384119.700005.19234
Phenolic resinProprietary2.027709.000002.37213
subTotal22.53000100.0000026.35704
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00045
Tin alloyTin (Sn)7440-31-53.8496299.990004.50353
subTotal3.85000100.000004.50398
Solder PasteLead alloyLead (Pb)7439-92-15.5130092.500006.44946
Silver (Ag)7440-22-40.149002.500000.17431
Tin (Sn)7440-31-50.298005.000000.34862
subTotal5.96000100.000006.97239
Solder PasteImpurityAntimony (Sb)7440-36-00.002090.030000.00244
Lead alloyLead (Pb)7439-92-16.4359192.470007.52914
Silver (Ag)7440-22-40.174002.500000.20356
Tin (Sn)7440-31-50.348005.000000.40711
subTotal6.96000100.000008.14225
total85.48000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.