Chemical content PSMN2R1-30YLE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Download chemical content (.PDF)

Type number	Package	Package description	Total product weight
PSMN2R1-30YLE	SOT669	LFPAK	98.12000 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
934664066115	2	1	260		1	260			Hsin-chu, Taiwan; Cabuyao, Philippines

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Die	Doped silicon	Silicon (Si)	7440-21-3	0.60000	100.00000	0.61150
		subTotal		0.60000	100.00000	0.61150

Clip	Copper alloy	Copper (Cu)	7440-50-8	27.34520	99.80000	27.86914
		Iron (Fe)	7439-89-6	0.04110	0.15000	0.04189
		Phosphorus (P)	7723-14-0	0.01370	0.05000	0.01396
		subTotal		27.40000	100.00000	27.92499

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	37.83797	99.81000	38.56295
		Iron (Fe)	7439-89-6	0.05686	0.15000	0.05795
		Phosphorus (P)	7723-14-0	0.01516	0.04000	0.01545
		subTotal		37.91000	100.00000	38.63635

Mould Compound	Filler	Silica fused	60676-86-0	13.96860	62.00000	14.23624
	Flame retardant	Aluminium Hydroxide (Al(OH)3)	21645-51-2	3.49215	15.50000	3.55906
	Impurity	Silicon Dioxide (SiO2)	14808-60-7	0.04506	0.20000	0.04592
	Pigment	Carbon black	1333-86-4	0.11265	0.50000	0.11481
	Polymer	Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)	29690-82-2	2.47830	11.00000	2.52578
		Phenolic resin	Proprietary	1.98264	8.80000	2.02063
		Tetramethylbiphenyl diglycidyl ether	85954-11-6	0.45060	2.00000	0.45923
		subTotal		22.53000	100.00000	22.96167

Post-Plating	Impurity	Non hazardous	Proprietary	0.00038	0.01000	0.00039
	Tin alloy	Tin (Sn)	7440-31-5	3.84962	99.99000	3.92337
		subTotal		3.85000	100.00000	3.92376

Solder Paste	Lead alloy	Lead (Pb)	7439-92-1	1.52625	92.50000	1.55549
		Silver (Ag)	7440-22-4	0.04125	2.50000	0.04204
		Tin (Sn)	7440-31-5	0.08250	5.00000	0.08408
		subTotal		1.65000	100.00000	1.68161

Solder Paste	Impurity	Antimony (Sb)	7440-36-0	0.00125	0.03000	0.00128
	Lead alloy	Lead (Pb)	7439-92-1	3.86525	92.47000	3.93930
		Silver (Ag)	7440-22-4	0.10450	2.50000	0.10650
		Tin (Sn)	7440-31-5	0.20900	5.00000	0.21300
		subTotal		4.18000	100.00000	4.26008

		total		98.12000	100.00000	100.00000

Note(s):
¹This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.