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Chemical content PSMN2R8-25MLC

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Type numberPackagePackage descriptionTotal product weight
PSMN2R8-25MLCSOT1210mLFPAK38.80000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934066944115512601260Hsin-chu, Taiwan; D-22529 HAMBURG, Germany; Cabuyao, PhilippinesLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.60000100.000004.12371
subTotal1.60000100.000004.12371
ClipCopper alloyCopper (Cu)7440-50-85.6886099.8000014.66134
Iron (Fe)7439-89-60.008550.150000.02204
Phosphorus (P)7723-14-00.002850.050000.00735
subTotal5.70000100.0000014.69073
Lead FrameCopper alloyCopper (Cu)7440-50-813.8722099.8000035.75309
Iron (Fe)7439-89-60.020850.150000.05374
Phosphorus (P)7723-14-00.006950.050000.01791
subTotal13.90000100.0000035.82474
Mould CompoundFillerSilica fused60676-86-06.0563071.0000015.60902
PigmentCarbon black1333-86-40.025590.300000.06595
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.6804119.700004.33095
Phenolic resinProprietary0.767709.000001.97861
subTotal8.53000100.0000021.98453
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00099
Tin alloyTin (Sn)7440-31-53.8496299.990009.92169
subTotal3.85000100.000009.92268
Solder PasteLead alloyLead (Pb)7439-92-14.7822592.5000012.32539
Silver (Ag)7440-22-40.129252.500000.33312
Tin (Sn)7440-31-50.258505.000000.66624
subTotal5.17000100.0000013.32475
total38.80000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.