Chemical content PSMN4R4-30MLC

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

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Type number	Package	Package description	Total product weight
PSMN4R4-30MLC	SOT1210	mLFPAK	37.52000 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
934066938115	5	1	260		1	260			D-22529 HAMBURG, Germany; Cabuyao, Philippines; Hsin-chu, Taiwan

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Die	Doped silicon	Silicon (Si)	7440-21-3	1.10000	100.00000	2.93177
		subTotal		1.10000	100.00000	2.93177

Clip	Copper alloy	Copper (Cu)	7440-50-8	5.68860	99.80000	15.16151
		Iron (Fe)	7439-89-6	0.00855	0.15000	0.02279
		Phosphorus (P)	7723-14-0	0.00285	0.05000	0.00760
		subTotal		5.70000	100.00000	15.19190

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	13.87220	99.80000	36.97281
		Iron (Fe)	7439-89-6	0.02085	0.15000	0.05557
		Phosphorus (P)	7723-14-0	0.00695	0.05000	0.01852
		subTotal		13.90000	100.00000	37.04690

Mould Compound	Filler	Silica fused	60676-86-0	6.05630	71.00000	16.14152
	Pigment	Carbon black	1333-86-4	0.02559	0.30000	0.06820
	Polymer	Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)	29690-82-2	1.68041	19.70000	4.47870
		Phenolic resin	Proprietary	0.76770	9.00000	2.04611
		subTotal		8.53000	100.00000	22.73453

Post-Plating	Impurity	Non hazardous	Proprietary	0.00038	0.01000	0.00103
	Tin alloy	Tin (Sn)	7440-31-5	3.84962	99.99000	10.26017
		subTotal		3.85000	100.00000	10.26120

Solder Paste	Lead alloy	Lead (Pb)	7439-92-1	4.10700	92.50000	10.94616
		Silver (Ag)	7440-22-4	0.11100	2.50000	0.29584
		Tin (Sn)	7440-31-5	0.22200	5.00000	0.59168
		subTotal		4.44000	100.00000	11.83368

		total		37.52000	100.00000	100.00000

Note(s):
¹This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.