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Chemical content PSMN8R5-40MSD

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Type numberPackagePackage descriptionTotal product weight
PSMN8R5-40MSDSOT1210mLFPAK36.31000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934661554115112601240Hsin-chu, Taiwan; Cabuyao, PhilippinesLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.90000100.000002.47866
subTotal0.90000100.000002.47866
ClipCopper alloyCopper (Cu)7440-50-85.6886099.8000015.66676
Iron (Fe)7439-89-60.008550.150000.02355
Phosphorus (P)7723-14-00.002850.050000.00785
subTotal5.70000100.0000015.69816
Lead FrameCopper alloyCopper (Cu)7440-50-813.8722099.8000038.20490
Iron (Fe)7439-89-60.020850.150000.05742
Phosphorus (P)7723-14-00.006950.050000.01914
subTotal13.90000100.0000038.28146
Mould CompoundFillerSilica fused60676-86-05.2886062.0000014.56513
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-21.3221515.500003.64128
ImpuritySilicon Dioxide (SiO2)14808-60-70.017060.200000.04698
PigmentCarbon black1333-86-40.042650.500000.11746
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.9383011.000002.58414
Phenolic resinProprietary0.750648.800002.06731
Tetramethylbiphenyl diglycidyl ether85954-11-60.170602.000000.46984
subTotal8.53000100.0000023.49214
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00106
Tin alloyTin (Sn)7440-31-53.8496299.9900010.60208
subTotal3.85000100.0000010.60314
Solder PasteLead alloyLead (Pb)7439-92-13.1727592.500008.73795
Silver (Ag)7440-22-40.085752.500000.23616
Tin (Sn)7440-31-50.171505.000000.47232
subTotal3.43000100.000009.44643
total36.31000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.