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Chemical content PSMN9R8-100YSF

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Type numberPackagePackage descriptionTotal product weight
PSMN9R8-100YSFSOT669LFPAK73.52000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662279115212601260Sherman, United States Of America; Cabuyao, Philippines; Manchester, United Kingdom; Cardiff, Great BritainLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-32.46000100.000003.34603
subTotal2.46000100.000003.34603
ClipCopper alloyCopper (Cu)7440-50-84.9933899.867626.79187
Iron (Fe)7439-89-60.005000.099910.00679
Phosphorus (P)7723-14-00.001620.032470.00221
subTotal5.00000100.000006.80087
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100051.46623
Iron (Fe)7439-89-60.056860.150000.07735
Phosphorus (P)7723-14-00.015160.040000.02063
subTotal37.91000100.0000051.56421
Mould CompoundFillerSilica -amorphous-7631-86-92.2290010.000003.03183
Silica fused60676-86-016.7175075.0000022.73871
PigmentCarbon black1333-86-40.066870.300000.09095
PolymerEpoxy resin systemProprietary1.716337.700002.33451
Phenolic resinProprietary1.560307.000002.12228
subTotal22.29000100.0000030.31828
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00052
Tin alloyTin (Sn)7440-31-53.8496299.990005.23615
subTotal3.85000100.000005.23667
Solder PasteLead alloyLead (Pb)7439-92-11.4152592.500001.92499
Silver (Ag)7440-22-40.038252.500000.05203
Tin (Sn)7440-31-50.076505.000000.10405
subTotal1.53000100.000002.08107
Solder PasteImpurityAntimony (Sb)7440-36-00.000140.030000.00020
Lead alloyLead (Pb)7439-92-10.4438692.470000.60372
Silver alloySilver (Ag)7440-22-40.012002.500000.01632
Tin alloyTin (Sn)7440-31-50.024005.000000.03264
subTotal0.48000100.000000.65288
total73.52000100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.