Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content PSMNR55-40SSH

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMNR55-40SSHSOT1235LFPAK88354.02400 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346615771185126030 s126020 s3Seremban, Malaysia; Cabuyao, Philippines; Hsin-chu, TaiwanLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-33.50000100.000000.98863
subTotal3.50000100.000000.98863
ClipCopper alloyCopper (Cu)7440-50-860.2095999.8600017.00721
Iron (Fe)7439-89-60.066320.110000.01873
Phosphorus (P)7723-14-00.018090.030000.00511
subTotal60.29400100.0000017.03105
Lead FrameCopper alloyCopper (Cu)7440-50-8172.9275699.8600048.84628
Iron (Fe)7439-89-60.225120.130000.06359
Phosphorus (P)7723-14-00.051950.030000.01467
subTotal173.17000100.0000048.92454
Mould CompoundFillerSilica fused60676-86-063.3330062.0000017.88947
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-215.8332515.500004.47237
ImpuritySilicon Dioxide (SiO2)14808-60-70.204300.200000.05771
PigmentCarbon black1333-86-40.510750.500000.14427
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-72.043002.000000.57708
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-211.2365011.000003.17394
Phenolic resinProprietary8.989208.800002.53915
subTotal102.15000100.0000028.85399
Post-PlatingImpurityNon hazardousProprietary0.000490.010000.00014
Tin alloyTin (Sn)7440-31-54.8795199.990001.37830
subTotal4.88000100.000001.37844
Solder PasteImpurityAntimony (Sb)7440-36-00.002110.030000.00059
Lead alloyLead (Pb)7439-92-16.4913992.470001.83360
Silver (Ag)7440-22-40.175502.500000.04957
Tin (Sn)7440-31-50.351005.000000.09915
subTotal7.02000100.000001.98291
Solder PasteImpurityAntimony (Sb)7440-36-00.001200.040000.00034
Lead alloyLead (Pb)7439-92-12.7833592.470000.78620
Silver alloySilver (Ag)7440-22-40.075252.500000.02126
Tin alloyTin (Sn)7440-31-50.150505.000000.04251
subTotal3.01000100.000000.85031
total354.02400100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.