Chemical content PSMNR82-30YLE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Download chemical content (.PDF)

Type number	Package	Package description	Total product weight
PSMNR82-30YLE	SOT669	LFPAK	87.02000 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
934664061115	3	1	260		1	260			Hsin-chu, Taiwan; Cabuyao, Philippines

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Die	Doped silicon	Silicon (Si)	7440-21-3	1.42000	100.00000	1.63181
		subTotal		1.42000	100.00000	1.63181

Clip	Copper alloy	Copper (Cu)	7440-50-8	4.99000	99.80000	5.73431
		Iron (Fe)	7439-89-6	0.00750	0.15000	0.00862
		Phosphorus (P)	7723-14-0	0.00250	0.05000	0.00287
		subTotal		5.00000	100.00000	5.74580

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	37.83797	99.81000	43.48192
		Iron (Fe)	7439-89-6	0.05686	0.15000	0.06535
		Phosphorus (P)	7723-14-0	0.01516	0.04000	0.01743
		subTotal		37.91000	100.00000	43.56470

Mould Compound	Filler	Silica fused	60676-86-0	13.96860	62.00000	16.05217
	Flame retardant	Aluminium Hydroxide (Al(OH)3)	21645-51-2	3.49215	15.50000	4.01304
	Impurity	Silicon Dioxide (SiO2)	14808-60-7	0.04506	0.20000	0.05178
	Pigment	Carbon black	1333-86-4	0.11265	0.50000	0.12945
	Polymer	Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)	29690-82-2	2.47830	11.00000	2.84797
		Phenolic resin	Proprietary	1.98264	8.80000	2.27837
		Tetramethylbiphenyl diglycidyl ether	85954-11-6	0.45060	2.00000	0.51781
		subTotal		22.53000	100.00000	25.89059

Post-Plating	Impurity	Non hazardous	Proprietary	0.00038	0.01000	0.00044
	Tin alloy	Tin (Sn)	7440-31-5	3.84962	99.99000	4.42383
		subTotal		3.85000	100.00000	4.42427

Solder Paste	Lead alloy	Lead (Pb)	7439-92-1	5.77200	92.50000	6.63296
		Silver (Ag)	7440-22-4	0.15600	2.50000	0.17927
		Tin (Sn)	7440-31-5	0.31200	5.00000	0.35854
		subTotal		6.24000	100.00000	7.17077

Solder Paste	Impurity	Antimony (Sb)	7440-36-0	0.00302	0.03000	0.00347
	Lead alloy	Lead (Pb)	7439-92-1	9.31173	92.47000	10.70068
		Silver (Ag)	7440-22-4	0.25175	2.50000	0.28930
		Tin (Sn)	7440-31-5	0.50350	5.00000	0.57860
		subTotal		10.07000	100.00000	11.57205

		total		87.02000	100.00000	100.00000

Note(s):
¹This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.