×

Chemical content PSMNR90-50SLH

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PSMNR90-50SLHSOT1235LFPAK88355.96400 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934661312118312601240Hsin-chu, Taiwan; Cabuyao, Philippines; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-33.49000100.000000.98044
subTotal3.49000100.000000.98044
ClipCopper alloyCopper (Cu)7440-50-860.2095999.8600016.91452
Iron (Fe)7439-89-60.066320.110000.01863
Phosphorus (P)7723-14-00.018090.030000.00508
subTotal60.29400100.0000016.93823
Lead FrameCopper alloyCopper (Cu)7440-50-8172.9275699.8600048.58007
Iron (Fe)7439-89-60.225120.130000.06324
Phosphorus (P)7723-14-00.051950.030000.01459
subTotal173.17000100.0000048.65790
Mould CompoundFillerSilica fused60676-86-063.3330062.0000017.79197
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-215.8332515.500004.44799
ImpuritySilicon Dioxide (SiO2)14808-60-70.204300.200000.05739
PigmentCarbon black1333-86-40.510750.500000.14348
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-211.2365011.000003.15664
Phenolic resinProprietary8.989208.800002.52531
Tetramethylbiphenyl diglycidyl ether85954-11-62.043002.000000.57393
subTotal102.15000100.0000028.69671
Post-PlatingImpurityNon hazardousProprietary0.000490.010000.00014
Tin alloyTin (Sn)7440-31-54.8795199.990001.37079
subTotal4.88000100.000001.37093
Solder PasteImpurityAntimony (Sb)7440-36-00.001600.030000.00045
Lead alloyLead (Pb)7439-92-14.9286592.470001.38459
Silver (Ag)7440-22-40.133252.500000.03743
Tin (Sn)7440-31-50.266505.000000.07487
subTotal5.33000100.000001.49734
Solder PasteImpurityAntimony (Sb)7440-36-00.002660.040000.00075
Lead alloyLead (Pb)7439-92-16.1492692.470001.72749
Silver alloySilver (Ag)7440-22-40.166252.500000.04670
Tin alloyTin (Sn)7440-31-50.332505.000000.09341
subTotal6.65000100.000001.86835
total355.96400100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.