Discover Nexperia’s extensive portfolio of diodes, bipolar transistors, ESD protection devices, MOSFETs, GaN FETs, IGBTs, and analog & logic ICs. Our components power virtually every electronic design worldwide - from automotive and industrial to mobile and consumer applications.
Our products find applications across various industries, from automotive and industrial to power, computing, consumer, mobile, and wearables. With a commitment to innovation and sustainability, our components set benchmarks in efficiency, empowering our global customer base to develop energy-efficient and cutting-edge solutions.
Try out our devices and their performance with our comprehensive range of evaluation boards. Gain a deeper understanding of how our products can benefit your application, whether it's optimizing for efficiency, robustness, or reliability. You can find Application focus, Package focus, and different Nexperia Product focus boards here.
Wire bond die; 4 bonding pads; 4.3 x 6.7 x 0.15 mm
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| UC | Wire bond die; 4 bonding pads; 4.3 x 6.7 x 0.15 mm | 2019-07-02 |
No documents available