Features and benefits
- Fully automotive qualified to beyond AEC-Q101:
- -55 °C to +175 °C rating suitable for thermally demanding environments
- LFPAK88 package:
- Designed for smaller footprint and improved power density over older wire bond packages such as D²PAK for today’s space constrained high power automotive applications
- Thin package and copper clip enables LFPAK88 to be highly efficient thermally
- LFPAK copper clip technology enabling improvements over wire bond packages by:
- Increased maximum current capability and excellent current spreading
- Improved RDSon
- Low source inductance
- Low thermal resistance Rth
- LFPAK Gull Wing leads:
- Flexible leads enabling high Board Level Reliability absorbing mechanical and thermal cycling stress, unlike traditional QFN packages
- Visual (AOI) soldering inspection, no need for expensive x-ray equipment
- Easy solder wetting for good mechanical solder joint
- Unique 40 V Trench 9 superjunction technology:
- Reduced cell pitch and superjunction platform enables lower RDSon in the same footprint
- Improved SOA and avalanche capability compared to standard TrenchMOS
- Tight VGS(th) limits enable easy paralleling of MOSFETs
Applications
- 12 V automotive systems
- 48 V DC/DC systems (on 12 V secondary side)
- Higher power motors, lamps and solenoid control
- Reverse polarity protection
- LED lighting
- Ultra high performance power switching
Parametrics
Type number | Package version | Package name | Product status | Channel type | Number of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Date |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
BUK7S1R0-40H | SOT1235 | LFPAK88 | Production | N | 1 | 40 | 1 | 175 | 325 | 17 | 98 | 375 | 49 | 3 | Y | 7373 | 1578 | 2019-01-15 |
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
BUK7S1R0-40H | BUK7S1R0-40HJ ( 9346 605 61118 ) | Active | 7S1R040H | ![]() LFPAK88 (SOT1235) | SOT1235 | Reel 13" Q1/T1 |
Quality, reliability & chemical content
Type number | Orderable part number | Chemical content | RoHS / RHF | MSL | MSL leadfree |
---|---|---|---|---|---|
BUK7S1R0-40H | BUK7S1R0-40HJ | BUK7S1R0-40H | ![]() ![]() | 1 | 1 |
Documentation (6)
File name | Title | Type | Date |
---|---|---|---|
BUK7S1R0-40H | N-channel 40 V, 1.0 mΩ standard level MOSFET in LFPAK88 | Data sheet | 2019-05-07 |
Nexperia_document_leaflet_LFPAK88_A5_2019_CHN | 将功率密度提升到新高度 LFPAK88 | Leaflet | 2019-04-24 |
BUK7S1R0-40H | BUK7S1R0-40H SPICE model | SPICE model | 2019-11-11 |
TN00008 | Power MOSFET frequently asked questions and answers | Technical note | 2020-06-24 |
BUK7S1R0_RCthermal_ | BUK7S1R0 RC thermal design | Thermal design | 2019-05-07 |
BUK7S1R0-40H | BUK7S1R0-40H thermal model | Thermal model | 2019-05-07 |
Support
If you are in need of design/technical support, let us know and fill in the answer form, we'll get back to you shortly.
Models
File name | Title | Type | Date |
---|---|---|---|
BUK7S1R0-40H | BUK7S1R0-40H SPICE model | SPICE model | 2019-11-11 |
BUK7S1R0_RCthermal_ | BUK7S1R0 RC thermal design | Thermal design | 2019-05-07 |
BUK7S1R0-40H | BUK7S1R0-40H thermal model | Thermal model | 2019-05-07 |
Ordering, pricing & availability
Type number | Orderable part number | Ordering code (12NC) | Packing | Buy online |
---|---|---|---|---|
BUK7S1R0-40H | BUK7S1R0-40HJ | 934660561118 | Reel 13" Q1/T1 | Order product |
Sample
As a Nexperia customer you can order samples via our sales organization or directly via our Online Sample Store: https://extranet.nexperia.com.
Sample orders normally take 2-4 days for delivery.
If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples.