BUK7S1R0-40H

Fully automotive qualified to beyond AEC-Q101:

• -55 °C to +175 °C rating suitable for thermally demanding environments

LFPAK88 package:

• Designed for smaller footprint and improved power density over older wire bond packages such as D²PAK for today’s space constrained high power automotive applications

• Thin package and copper clip enables LFPAK88 to be highly efficient thermally

LFPAK copper clip technology enabling improvements over wire bond packages by:

• Increased maximum current capability and excellent current spreading

• Improved R_DSon

• Low source inductance

• Low thermal resistance R_th

LFPAK Gull Wing leads:

• Flexible leads enabling high Board Level Reliability absorbing mechanical and thermal cycling stress, unlike traditional QFN packages

• Visual (AOI) soldering inspection, no need for expensive x-ray equipment

• Easy solder wetting for good mechanical solder joint

Unique 40 V Trench 9 superjunction technology:

• Reduced cell pitch and superjunction platform enables lower R_DSon in the same footprint

• Improved SOA and avalanche capability compared to standard TrenchMOS

• Tight V_GS(th) limits enable easy paralleling of MOSFETs

12 V automotive systems

48 V DC/DC systems (on 12 V secondary side)

Higher power motors, lamps and solenoid control

Reverse polarity protection

LED lighting

Ultra high performance power switching