Features and benefits
-
Fully automotive qualified to AEC-Q101:
-
175 °C rating suitable for thermally demanding environments
-
-
Trench 9 Superjunction technology:
-
Reduced cell pitch enables enhanced power density and efficiency with lower RDSon in same footprint
-
Improved SOA and avalanche capability compared to standard TrenchMOS
-
Tight VGS(th) limits enable easy paralleling of MOSFETs
-
-
LFPAK Gull Wing leads:
-
High Board Level Reliability absorbing mechanical stress during thermal cycling, unlike traditional QFN packages
-
Visual (AOI) soldering inspection, no need for expensive x-ray equipment
-
Easy solder wetting for good mechanical solder joint
-
-
LFPAK copper clip technology:
-
Improved reliability, with reduced Rth and RDSon
-
Increases maximum current capability and improved current spreading
-
Applications
-
12 V automotive systems
-
Motors, lamps and solenoid control
-
Start-Stop micro-hybrid applications
-
Transmission control
-
Ultra high performance power switching
Parametrics
Type number | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Date |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
BUK7Y1R7-40H | SOT669 | LFPAK56; Power-SO8 | Production | N | 1 | 40 | 1.7 | 175 | 120 | 10 | 56 | 294 | 25 | 3 | Y | 4095 | 1083 | 2015-05-11 |
PCB Symbol, Footprint and 3D Model
Model Name | Description |
---|---|
Package
Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
---|---|---|---|---|---|---|---|
BUK7Y1R7-40H | BUK7Y1R7-40HX ( 9340 693 03115 ) | Active | 71H740 | ![]() LFPAK56; Power-SO8 (SOT669) | SOT669 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT669_115 |
BUK7Y1R7-40H/A002 | BUK7Y1R7-40H/A002X ( 9346 654 31115 ) | Active | 71H740 | ![]() LFPAK56; Power-SO8 (SOT669) | SOT669 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT669_115 |
Environmental information
Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
---|---|---|---|---|
BUK7Y1R7-40H | BUK7Y1R7-40HX | BUK7Y1R7-40H | ![]() | |
BUK7Y1R7-40H/A002 | BUK7Y1R7-40H/A002X | BUK7Y1R7-40H/A002 | ![]() |
Documentation (19)
File name | Title | Type | Date |
---|---|---|---|
BUK7Y1R7-40H | N-channel 40 V, 1.7 mΩ standard level MOSFET in LFPAK56 | Data sheet | 2018-05-11 |
AN10273 | Power MOSFET single-shot and repetitive avalanche ruggedness rating | Application note | 2022-06-20 |
AN11158 | Understanding power MOSFET data sheet parameters | Application note | 2020-07-06 |
AN11160 | Designing RC Snubbers | Application note | 2023-02-03 |
AN11156 | Using Power MOSFET Zth Curves | Application note | 2021-01-04 |
AN11243 | Failure signature of Electrical Overstress on Power MOSFETs | Application note | 2017-12-21 |
AN11261 | RC Thermal Models | Application note | 2021-03-18 |
AN11599 | Using power MOSFETs in parallel | Application note | 2016-07-13 |
AN90001 | Designing in MOSFETs for safe and reliable gate-drive operation | Application note | 2017-05-05 |
AN10874_ZH | LFPAK MOSFET thermal design guide, Chinese version | Application note | 2020-04-30 |
AN11113_ZH | LFPAK MOSFET thermal design guide - Part 2 | Application note | 2020-04-30 |
nexperia_document_leaflet_LFPAK56_LR_2020 | The automotive Power-SO8 that packs a punch | Leaflet | 2020-04-22 |
BUK7xxxx-40H_LTspice_V3 | BUK7xxxx-40H Precision ElectroThermal (PET) LTspice model | PET SPICE model | 2022-09-26 |
BUK7Y1R7-40H | BUK7Y1R7-40H | SPICE model | 2017-08-11 |
TN00008 | Power MOSFET frequently asked questions and answers | Technical note | 2023-01-12 |
BUK7Y1R7-40H_RCthermal | BUK7Y1R7-40H_RCthermal | Thermal design | 2017-08-11 |
SOT669_115 | LFPAK56; Reel pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2022-05-10 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Support
If you are in need of design/technical support, let us know and fill in the answer form, we'll get back to you shortly.
Models
File name | Title | Type | Date |
---|---|---|---|
BUK7xxxx-40H_LTspice_V3 | BUK7xxxx-40H Precision ElectroThermal (PET) LTspice model | PET SPICE model | 2022-09-26 |
BUK7Y1R7-40H | BUK7Y1R7-40H | SPICE model | 2017-08-11 |
BUK7Y1R7-40H_RCthermal | BUK7Y1R7-40H_RCthermal | Thermal design | 2017-08-11 |
PCB Symbol, Footprint and 3D Model
Model Name | Description |
---|---|
Ordering, pricing & availability
Type number | Orderable part number | Ordering code (12NC) | Packing | Packing quantity | Buy online |
---|---|---|---|---|---|
BUK7Y1R7-40H | BUK7Y1R7-40HX | 934069303115 | SOT669_115 | - | Order product |
BUK7Y1R7-40H/A002 | BUK7Y1R7-40H/A002X | 934665431115 | SOT669_115 | - | Order product |
Sample
As a Nexperia customer you can order samples via our sales organization or directly via our Online Sample Store: https://extranet.nexperia.com.
Sample orders normally take 2-4 days for delivery.
If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples.
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.