Key features and benefits
- Compact 30 mm² footprint
- Industry standard 5 × 6 mm package for easy PCB integratin
- Optimized cost-to-performance balance
- Micro-leads for solder wettability
- Exposed heat sink for low thermal resistance
- Low RDS(on) down to 2.8 mΩ
- 30 V, 60 V and 100 V devices
- N- & P-channel, standard & logic-level variants
- AEC-Q101 side-wettable (-WF) package available
Applications
- Brushless DC motor control
- DC to DC solutions
- Low-power adaptors
- PC power supplies
- Power tools (battery powered)
Featured products
Featured documents
Latest videos
MLPAK MOSFET packaging - Scalable power for high-volume applications
Products
Automotive qualified products (AEC-Q100/Q101)
| Type number | Description | Status | Quick access |
|---|---|---|---|
| BUK9R4R5-40H | Logic level N-Channel MOSFET in MLPAK56-WF (SOT8038-2) | Production |
MOSFETs
| Type number | Description | Status | Quick access |
|---|---|---|---|
| BUK9R4R5-40H | Logic level N-Channel MOSFET in MLPAK56-WF (SOT8038-2) | Production | |
| PXN2R8-100RL | N-channel 100 V, 2.8 mOhm, logic level Trench MOSFET in MLPAK56 | Production | |
| PXN2R9-100RS | N-channel 100 V, 2.9 mOhm, standard level Trench MOSFET in MLPAK56 | Production | |
| PXN4R1-60RLA | N-channel 60 V, 4.1 mOhm, logic level Trench MOSFET in MLPAK56 | Development | |
| PXN5R0-60RLA | N-channel 60 V, 5.0 mOhm, logic level Trench MOSFET in MLPAK56 | Development | |
| PXN5R9-60RLA | N-channel 60 V, 5.9 mOhm, logic level Trench MOSFET in MLPAK56 | Development | |
| PXN7R3-60RLA | N-channel 60 V, 7.3 mOhm, logic level Trench MOSFET in MLPAK56 | Development |
Documentation
| File name | Title | Type | Date |
|---|---|---|---|
| AN11304.pdf | MOSFET load switch PCB with thermal measurement | Application note | 2013-01-28 |
| AN11119.pdf | Medium power small-signal MOSFETs in DC-to-DC conversion | Application note | 2013-05-07 |
| AN11599.pdf | Using power MOSFETs in parallel | Application note | 2016-07-13 |
| AN10441.pdf | Level shifting techniques in I2C-bus design | Application note | 2020-02-11 |
| AN90017.pdf | Load switches for mobile and computing applications | Application note | 2020-09-02 |
| AN11158_ZH.pdf | Understanding power MOSFET data sheet parameters | Application note | 2021-01-04 |
| SOT8002_1.step | 3D model for products with SOT8002-1 package | Design support | 2021-04-30 |
| AN90032.pdf | Low temperature soldering, application study | Application note | 2022-02-22 |
| AN50006_JP.pdf | リニアモードにおけるパワーMOSFET | Application note | 2022-06-06 |
| AN50005_translated_20230317.pdf | 大電力アプリケーションにおけるパワーMOSFETの並列接続 | Application note | 2023-04-03 |
| MLPAK56_combi.png | MLPAK56 MARCOM image | Marcom graphics | 2023-10-17 |
| vp_MLPAK56_MOSFETs.zip | MLPAK56 MOSFETs | Value proposition | 2024-10-06 |
| AN11156.pdf | Using Power MOSFET Zth Curves | Application note | 2025-09-08 |
| AN11243.pdf | Failure signature of Electrical Overstress on Power MOSFETs | Application note | 2025-09-08 |
| AN50014.pdf | Understanding the MOSFET peak drain current rating | Application note | 2025-09-08 |
| AN90001.pdf | Designing in MOSFETs for safe and reliable gate-drive operation | Application note | 2025-09-08 |
| AN10273.pdf | Power MOSFET single-shot and repetitive avalanche ruggedness rating | Application note | 2025-09-10 |
| AN11158.pdf | Understanding power MOSFET data sheet parameters | Application note | 2025-09-10 |
| AN11160.pdf | Designing RC Snubbers | Application note | 2025-09-10 |
| AN11261.pdf | RC Thermal Models | Application note | 2025-09-10 |
| AN50019.pdf | Thermal boundary condition study on MOSFET packages and PCB substrates | Application note | 2025-09-10 |
| AN90011.pdf | Half-bridge MOSFET switching and its impact on EMC | Application note | 2025-09-10 |
| AN90059.pdf | Power MOSFET gate driver fundamentals | Application note | 2025-09-10 |
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