Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content 1PS70SB16

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
1PS70SB16SOT323SC-705.543730 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93405492011513126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.060000100.0000001.082304
subTotal0.060000100.0000001.082304
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0016650.0900000.030034
Carbon (C)7440-44-00.0007400.0400000.013348
Chromium (Cr)7440-47-30.0016650.0900000.030034
Cobalt (Co)7440-48-40.0079550.4300000.143495
Iron (Fe)7439-89-60.82602544.65000014.900166
Manganese (Mn)7439-96-50.0127650.6900000.230260
Nickel (Ni)7440-02-00.63899034.54000011.526355
Phosphorus (P)7723-14-00.0003700.0200000.006674
Silicon (Si)7440-21-30.0048100.2600000.086765
Sulphur (S)7704-34-90.0003700.0200000.006674
Pure metal layerCopper (Cu)7440-50-80.31172516.8500005.623019
Silver (Ag)7440-22-40.0429202.3200000.774208
subTotal1.850000100.00000033.371034
Mould CompoundFillerSilica fused60676-86-02.55340075.10000046.059242
PigmentCarbon black1333-86-40.0102000.3000000.183992
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.59500017.50000010.732846
Phenol Formaldehyde resin (generic)9003-35-40.2414007.1000004.354469
subTotal3.400000100.00000061.330548
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000070.0030000.000124
Bismuth (Bi)7440-69-90.0000020.0010000.000041
Copper (Cu)7440-50-80.0000020.0010000.000041
Lead (Pb)7439-92-10.0000120.0050000.000207
Tin solderTin (Sn)7440-31-50.22997799.9900004.148416
subTotal0.230000100.0000004.148831
WirePure metalCopper (Cu)7440-50-80.003725100.0000000.067193
subTotal0.003725100.0000000.067193
total5.543730100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.