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Chemical content 2PC4617QMB

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Type numberPackagePackage descriptionTotal product weight
2PC4617QMBSOT883BXQFN30.68002 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065897315612601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.33528
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04619
Phenolic resinProprietary0.0004113.530000.05969
subTotal0.00300100.000000.44116
DieDoped siliconSilicon (Si)7440-21-30.03000100.000004.41163
subTotal0.03000100.000004.41163
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09882
Copper (Cu)7440-50-80.2632094.0000038.70474
Tin (Sn)7440-31-50.000670.240000.09882
Zinc (Zn)7440-66-60.000590.210000.08647
Pure metal layerGold (Au)7440-57-50.000220.080000.03294
Nickel (Ni)7440-02-00.013834.940002.03406
Palladium (Pd)7440-05-30.000810.290000.11941
subTotal0.28000100.0000041.17526
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.49966
Silica fused60676-86-00.2040060.0000029.99912
Flame retardantMetal hydroxideProprietary0.010203.000001.49996
ImpurityBismuth (Bi)7440-69-90.001700.500000.24999
PigmentCarbon black1333-86-40.001700.500000.24999
PolymerEpoxy resin systemProprietary0.023807.000003.49990
Phenolic resinProprietary0.020406.000002.99991
subTotal0.34000100.0000049.99853
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00163
Tin solderTin (Sn)7440-31-50.0199999.940002.93933
subTotal0.02000100.000002.94109
WireImpurityNon hazardousProprietary0.000000.010000.00010
Pure metalGold (Au)7440-57-50.0070199.990001.03148
subTotal0.00701100.000001.03158
total0.68002100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.