Chemical content 74ABT162245ADGG

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Type numberPackagePackage descriptionTotal product weight
74ABT162245ADGGSOT362-1TSSOP48189.50928 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352041301181212601235Nijmegen, Netherlands; Bangkok, Thailand; D-22529 HAMBURG, Germany; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-41.4418080.100000.76081
PolymerResin systemProprietary0.3582019.900000.18901
DieDoped siliconSilicon (Si)7440-21-32.06093100.000001.08751
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-864.5826097.0000034.07886
Nickel (Ni)7440-02-01.997403.000001.05399
Mould CompoundAdditiveNon hazardousProprietary5.452004.700002.87690
FillerSilica fused60676-86-091.6400079.0000048.35647
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.960006.000003.67264
PigmentCarbon black1333-86-40.232000.200000.12242
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-64.640004.000002.44843
Non hazardousProprietary4.756004.100002.50964
Tetramethylbiphenyl diglycidyl ether85954-11-62.320002.000001.22421
Pre-PlatingPure metal layerGold (Au)7440-57-50.028001.000000.01478
Nickel (Ni)7440-02-02.7160097.000001.43318
Palladium (Pd)7440-05-30.056002.000000.02955
WirePure metalCopper (Cu)7440-50-80.26835100.000000.14160
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.