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Chemical content 74AHC123ABQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC123ABQ-Q100SOT763-1DHVQFN1621.56303 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300986115512601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.37028
PolymerResin systemProprietary0.0198419.900000.09199
subTotal0.09968100.000000.46227
DieDoped siliconSilicon (Si)7440-21-30.23490100.000001.08936
subTotal0.23490100.000001.08936
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.9746797.4700036.98309
Iron (Fe)7439-89-60.196362.400000.91063
Phosphorus (P)7723-14-00.002450.030000.01138
Zinc (Zn)7440-66-60.008180.100000.03794
subTotal8.18167100.0000037.94304
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.67861
FillerSilica -amorphous-7631-86-90.434103.490002.01318
Silica fused60676-86-010.5503184.8200048.92777
PigmentCarbon black1333-86-40.019900.160000.09229
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.62299
Epoxy resin systemProprietary0.197771.590000.91718
Phenolic resinProprietary0.279872.250001.29790
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.13432
subTotal12.43847100.0000057.68424
Pre-PlatingPure metal layerGold (Au)7440-57-50.016373.000000.07590
Nickel (Ni)7440-02-00.5035192.300002.33504
Palladium (Pd)7440-05-30.016913.100000.07843
Silver (Ag)7440-22-40.008731.600000.04048
subTotal0.54551100.000002.52985
WirePure metalCopper (Cu)7440-50-80.0606396.550000.28120
Pure metal layerGold (Au)7440-57-50.000220.350000.00102
Palladium (Pd)7440-05-30.001953.100000.00903
subTotal0.06280100.000000.29125
total21.56303100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.