Chemical content 74AHC126BQ-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
74AHC126BQ-Q100SOT762-1DHVQFN1417.74456 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935298637115612601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0560780.100000.31598
PolymerResin systemProprietary0.0139319.900000.07850
DieDoped siliconSilicon (Si)7440-21-30.39829100.000002.24458
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.3550497.4700035.81404
Iron (Fe)7439-89-60.156482.400000.88185
Phosphorus (P)7723-14-00.001960.030000.01102
Zinc (Zn)7440-66-60.006520.100000.03674
Mould CompoundFillerSilica -amorphous-7631-86-90.836307.980004.71302
Silica fused60676-86-08.3936480.0920047.30262
PigmentCarbon black1333-86-40.097250.928000.54808
PolymerEpoxy resin systemProprietary0.885568.450004.99060
Phenolic resinProprietary0.267242.550001.50604
Pre-PlatingPure metal layerGold (Au)7440-57-50.006603.000000.03719
Nickel (Ni)7440-02-00.2030692.300001.14435
Palladium (Pd)7440-05-30.006823.100000.03843
Silver (Ag)7440-22-40.003521.600000.01984
WirePure metalCopper (Cu)7440-50-80.05627100.000000.31711
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.