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Chemical content 74AHC138BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC138BQ-Q100SOT763-1DHVQFN1621.60534 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300181115512601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.36956
PolymerResin systemProprietary0.0198419.900000.09181
subTotal0.09968100.000000.46137
DieDoped siliconSilicon (Si)7440-21-30.27813100.000001.28733
subTotal0.27813100.000001.28733
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-87.9746797.4700036.91066
Iron (Fe)7439-89-60.196362.400000.90885
Phosphorus (P)7723-14-00.002450.030000.01136
Zinc (Zn)7440-66-60.008180.100000.03787
subTotal8.18167100.0000037.86874
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.67532
FillerSilica -amorphous-7631-86-90.434103.490002.00924
Silica fused60676-86-010.5503184.8200048.83196
PigmentCarbon black1333-86-40.019900.160000.09211
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.62177
Epoxy resin systemProprietary0.197771.590000.91538
Phenolic resinProprietary0.279872.250001.29535
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.13014
subTotal12.43847100.0000057.57127
Pre-PlatingPure metal layerGold (Au)7440-57-50.016373.000000.07575
Nickel (Ni)7440-02-00.5035192.300002.33047
Palladium (Pd)7440-05-30.016913.100000.07827
Silver (Ag)7440-22-40.008731.600000.04040
subTotal0.54551100.000002.52489
WirePure metalCopper (Cu)7440-50-80.0597496.550000.27650
Pure metal layerGold (Au)7440-57-50.000220.350000.00100
Palladium (Pd)7440-05-30.001923.100000.00888
subTotal0.06187100.000000.28638
total21.60534100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.