Chemical content 74AHC164BQ

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Type numberPackagePackage descriptionTotal product weight
74AHC164BQSOT762-1DHVQFN1417.90689 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352833931151712601235Shanghai, China; Suzhou, China; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0186380.100000.10405
PolymerResin systemProprietary0.0046319.900000.02585
DieDoped siliconSilicon (Si)7440-21-30.15110100.000000.84383
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-86.8029797.4700037.99081
Iron (Fe)7439-89-60.167512.400000.93545
Phosphorus (P)7723-14-00.002090.030000.01169
Zinc (Zn)7440-66-60.006980.100000.03898
Mould CompoundAdditiveNon hazardousProprietary0.306132.910001.70958
FillerSilica -amorphous-7631-86-90.367153.490002.05032
Silica fused60676-86-08.9230684.8200049.83034
PigmentCarbon black1333-86-40.016830.160000.09400
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.113621.080000.63448
Epoxy resin systemProprietary0.167271.590000.93410
Phenolic resinProprietary0.236702.250001.32184
Tetramethylbiphenyl diglycidyl ether85954-11-60.389243.700002.17369
Pre-PlatingPure metal layerGold (Au)7440-57-50.001771.000000.00989
Nickel (Ni)7440-02-00.1612391.000000.90038
Palladium (Pd)7440-05-30.014178.000000.07915
WirePure metalCopper (Cu)7440-50-80.0538796.550000.30084
Pure metal layerGold (Au)7440-57-50.000200.350000.00109
Palladium (Pd)7440-05-30.001733.100000.00966
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.