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Chemical content 74AHC1G04GW-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC1G04GW-Q100SOT353-1UMT55.47670 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300717125712601235Bangkok, Thailand; Seremban, Malaysia; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0075075.000000.13694
PolymerResin systemProprietary0.0025025.000000.04565
subTotal0.01000100.000000.18259
DieDoped siliconSilicon (Si)7440-21-30.06536100.000001.19336
subTotal0.06536100.000001.19336
Lead FrameCopper alloyCopper (Cu)7440-50-81.9034196.6200034.75476
Iron (Fe)7439-89-60.041962.130000.76617
Phosphorus (P)7723-14-00.000590.030000.01079
Zinc (Zn)7440-66-60.002560.130000.04676
MetallisationSilver (Ag)7440-22-40.021471.090000.39208
subTotal1.97000100.0000035.97056
Mould CompoundAdditiveNon hazardousProprietary0.090192.900001.64679
Triphenylphosphine603-35-00.001560.050000.02839
FillerSilica -amorphous-7631-86-92.2392072.0000040.88593
PigmentCarbon black1333-86-40.001560.050000.02839
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4665015.000008.51790
Phenol Formaldehyde resin (generic)9003-35-40.3110010.000005.67860
subTotal3.11000100.0000056.78600
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00017
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00028
Tin solderTin (Sn)7440-31-50.3099799.990005.65978
subTotal0.31000100.000005.66035
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0113599.990000.20719
subTotal0.01135100.000000.20721
total5.47670100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.