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Chemical content 74AHC1G125GV-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC1G125GV-Q100SOT753SO510.39664 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935299235125412601235Seremban, Malaysia; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0075075.000000.07214
PolymerResin systemProprietary0.0025025.000000.02405
subTotal0.01000100.000000.09619
DieDoped siliconSilicon (Si)7440-21-30.07360100.000000.70797
subTotal0.07360100.000000.70797
Lead FrameCopper alloyCopper (Cu)7440-50-83.1906694.9600030.68930
Iron (Fe)7439-89-60.085682.550000.82411
Lead (Pb)7439-92-10.001010.030000.00970
Phosphorus (P)7723-14-00.005040.150000.04848
Tin (Sn)7440-31-50.006720.200000.06464
Pure metal layerSilver (Ag)7440-22-40.070902.110000.68191
subTotal3.36000100.0000032.31814
Mould CompoundFillerSilica fused60676-86-04.6008071.0000044.25276
PigmentCarbon black1333-86-40.019440.300000.18698
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2765619.7000012.27858
Phenolic resinProprietary0.583209.000005.60950
subTotal6.48000100.0000062.32782
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00013
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000020.005000.00021
Tin solderTin (Sn)7440-31-50.4399699.990004.23171
subTotal0.44000100.000004.23213
WireGold alloyGold (Au)7440-57-50.0327099.000000.31457
Palladium (Pd)7440-05-30.000331.000000.00318
subTotal0.03304100.000000.31775
total10.39664100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.