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Chemical content 74AHC257D

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Type numberPackagePackage descriptionTotal product weight
74AHC257DSOT109-1SO16142.22274 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352654671181012601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-42.0025080.100001.40800
PolymerResin systemProprietary0.4975019.900000.34980
subTotal2.50000100.000001.75780
DieDoped siliconSilicon (Si)7440-21-30.29304100.000000.20604
subTotal0.29304100.000000.20604
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-869.2037097.4700048.65867
Iron (Fe)7439-89-61.704002.400001.19812
Phosphorus (P)7723-14-00.021300.030000.01498
Zinc (Zn)7440-66-60.071000.100000.04992
subTotal71.00000100.0000049.92169
Mould CompoundAdditiveNon hazardousProprietary3.196004.700002.24718
FillerSilica fused60676-86-053.7200079.0000037.77174
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.080006.000002.86874
PigmentCarbon black1333-86-40.136000.200000.09562
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.720004.000001.91249
Non hazardousProprietary2.788004.100001.96031
Tetramethylbiphenyl diglycidyl ether85954-11-61.360002.000000.95625
subTotal68.00000100.0000047.81233
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00211
Nickel (Ni)7440-02-00.2910097.000000.20461
Palladium (Pd)7440-05-30.006002.000000.00422
subTotal0.30000100.000000.21094
WirePure metalCopper (Cu)7440-50-80.12970100.000000.09120
subTotal0.12970100.000000.09120
total142.22274100.00000100.00000
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.