Chemical content 74AHC273BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC273BQ-Q100SOT764-1DHVQFN2027.38388 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300187115412601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0961280.100000.35101
PolymerResin systemProprietary0.0238819.900000.08720
DieDoped siliconSilicon (Si)7440-21-30.47472100.000001.73357
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-89.8347297.4700035.91428
Iron (Fe)7439-89-60.242162.400000.88432
Phosphorus (P)7723-14-00.003030.030000.01105
Zinc (Zn)7440-66-60.010090.100000.03685
Mould CompoundFillerSilica -amorphous-7631-86-91.295957.980004.73254
Silica fused60676-86-013.0069480.0920047.49853
PigmentCarbon black1333-86-40.150710.928000.55035
PolymerEpoxy resin systemProprietary1.372288.450005.01127
Phenolic resinProprietary0.414122.550001.51228
Pre-PlatingPure metal layerGold (Au)7440-57-50.010503.000000.03834
Nickel (Ni)7440-02-00.3230592.300001.17971
Palladium (Pd)7440-05-30.010853.100000.03962
Silver (Ag)7440-22-40.005601.600000.02045
WirePure metalCopper (Cu)7440-50-80.10916100.000000.39864
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.