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Chemical content 74AHC574BQ

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Type numberPackagePackage descriptionTotal product weight
74AHC574BQSOT764-1DHVQFN2028.10129 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352855461151212601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0683180.100000.24308
PolymerResin systemProprietary0.0169719.900000.06039
subTotal0.08528100.000000.30347
DieDoped siliconSilicon (Si)7440-21-30.41720100.000001.48462
subTotal0.41720100.000001.48462
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.5891697.4700037.68211
Iron (Fe)7439-89-60.260742.400000.92785
Phosphorus (P)7723-14-00.003260.030000.01160
Zinc (Zn)7440-66-60.010860.100000.03866
subTotal10.86402100.0000038.66022
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.69569
FillerSilica -amorphous-7631-86-90.571483.490002.03366
Silica fused60676-86-013.8892084.8200049.42548
PigmentCarbon black1333-86-40.026200.160000.09323
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62933
Epoxy resin systemProprietary0.260361.590000.92651
Phenolic resinProprietary0.368442.250001.31110
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.15603
subTotal16.37491100.0000058.27103
Pre-PlatingPure metal layerGold (Au)7440-57-50.002761.000000.00981
Nickel (Ni)7440-02-00.2509591.000000.89302
Palladium (Pd)7440-05-30.022068.000000.07851
subTotal0.27577100.000000.98134
WirePure metalCopper (Cu)7440-50-80.0812196.550000.28899
Pure metal layerGold (Au)7440-57-50.000290.350000.00105
Palladium (Pd)7440-05-30.002613.100000.00928
subTotal0.08411100.000000.29932
total28.10129100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.