Chemical content 74AHC574BQ

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Type numberPackagePackage descriptionTotal product weight
74AHC574BQSOT764-1DHVQFN2027.63531 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352855461151112601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0961280.100000.34782
PolymerResin systemProprietary0.0238819.900000.08641
DieDoped siliconSilicon (Si)7440-21-30.58408100.000002.11352
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-89.9906897.4700036.15185
Iron (Fe)7439-89-60.246002.400000.89017
Phosphorus (P)7723-14-00.003080.030000.01113
Zinc (Zn)7440-66-60.010250.100000.03709
Mould CompoundFillerSilica -amorphous-7631-86-91.295957.980004.68948
Silica fused60676-86-013.0069480.0920047.06638
PigmentCarbon black1333-86-40.150710.928000.54534
PolymerEpoxy resin systemProprietary1.372288.450004.96568
Phenolic resinProprietary0.414122.550001.49852
Pre-PlatingPure metal layerGold (Au)7440-57-50.010503.000000.03799
Nickel (Ni)7440-02-00.3230592.300001.16898
Palladium (Pd)7440-05-30.010853.100000.03926
Silver (Ag)7440-22-40.005601.600000.02026
WirePure metalCopper (Cu)7440-50-80.09123100.000000.33013
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.