Chemical content 74AHC595BQ

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Type numberPackagePackage descriptionTotal product weight
74AHC595BQSOT763-1DHVQFN1621.85968 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352816211151212601235Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0648880.100000.29681
PolymerResin systemProprietary0.0161219.900000.07374
DieDoped siliconSilicon (Si)7440-21-30.17725100.000000.81084
Lead FrameCopper alloyCopper (Cu)7440-50-89.8204196.0995044.92476
Iron (Fe)7439-89-60.237082.320001.08456
Lead (Pb)7439-92-10.000050.000500.00023
Phosphorus (P)7723-14-00.008180.080000.03740
Zinc (Zn)7440-66-60.012260.120000.05610
Gold alloyGold (Au)7440-57-50.003060.029970.01401
Silver (Ag)7440-22-40.002040.019980.00934
ImpurityNon hazardousProprietary0.000130.001280.00060
Pure metal layerCopper (Cu)7440-50-80.005100.049950.02335
Nickel (Ni)7440-02-00.130671.278720.59778
Mould CompoundAdditiveNon hazardousProprietary0.329352.910001.50667
FillerSilica -amorphous-7631-86-90.395003.490001.80697
Silica fused60676-86-09.5999384.8200043.91614
PigmentCarbon black1333-86-40.018110.160000.08284
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.122231.080000.55918
Epoxy resin systemProprietary0.179961.590000.82323
Phenolic resinProprietary0.254662.250001.16495
Tetramethylbiphenyl diglycidyl ether85954-11-60.418773.700001.91570
WirePure metalCopper (Cu)7440-50-80.0622196.550000.28458
Pure metal layerGold (Au)7440-57-50.000230.350000.00103
Palladium (Pd)7440-05-30.002003.100000.00914
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.